After triple-channel DDR3 2000 set the new benchmark, Team Group Inc. continues to explore the potential of DDR3 memory, and the coming era of Core i7/i5 (Lynnfied, LGA 1156) brings DDR3 2000 into the low voltage era of 1.65V.

To achieve the best quality possible, Xtreem LV DDR3 1333 is supported by Team Group’s excellent vertical integration. From granule screening, platform testing, to product testing, Team Group insists on stringent quality control. The high quality is widely trusted by the users. In addition, the memory module is covered by the unique X-shape radiation chip and the high-coefficient conductive gel tightly grabs the granules to maximize stability under extreme speed.

Xtreem LV DDR3 2000 is created by 128x8 BGA packing original granules. A single unit is capacitated to reach as high as 2GB to satisfy the needs of 3D game players. Incorporated by high-efficiency 8-layer PCB, Xtreem LV DDR3 2000 is put under 100% burn test with comparison to the cross-platform motherboard tests of the leading brands. And the built-in XMP (Extreme Memory Profiles) function offers simple configuration for pros and armatures alike without having to set up a complex BIOS.

Item	Specification
Suitable for	Desktop PCs
Module Type	240Pin Unbuffered DIMM Non ECC
DRAM Density	128x8
Capacity	4GB Kit (2x2GB)
Data transfer bandwidth	16,000MB/Sec (PC3 16000)
CL-value	9-9-9-24-2T
Working voltage	1.5V~1.65V
PCB	8-layer PCB
Extra features	Aluminum heat-sink
Warranty	Lifetime warranty