Developed in conjunction with TIM Consultants and based on their
acclaimed 0098 grease, Matrix Thixotropic Premium Thermal Compound
offers optimum performance in demanding moderate to large bond line
situations. It is designed for a wide range of applications between
modern high-power CPUs and GPUs and high-performance heatsinks or
water-cooling solutions.
Features:
Thermal Matrix:
The unique blend of micronized Zinc Oxide, Aluminum Oxide,
and Aluminum particles in silicone base oil forms a thermally
conductive matrix that provides class-leading performance and
exceptional long-term stability.
Performance Attributes:
Matrix’s silicone suspension fluid and conductive fillers are
engineered for easy application and superior surface wetting. This
enhances performance in moderate bond line applications and offers
better performance than other Arctic Silver retail market thermal
compounds in large bond line situations. During initial use, Matrix wets
the thermal surfaces and fills the microscopic voids and valleys. With
time, pressure, heat and vibration, Matrix achieves superior thermal
contact between the surfaces.
Electrical Insulator:
Matrix is not electrically conductive.
Performance:
2 to 12 degrees Celsius lower CPU full load core temperatures than
standard thermal compounds or thermal pads when measured with a
calibrated thermal diode imbedded in the hottest section of the CPU
core.
Matrix is sold in:
▪ Retail: 2.5 gram syringe
▪ OEM / Industrial and Research : 75 gram syringes.
(Purchased Directly From Arctic Silver, Inc.) Specifications:
Average Particle Size:
7.8 microns 0.00031 inch
Temperature Limits:
Peak: –50°C to 135°C
Coverage Area:
2.5-gram syringes. (About 1cc)
At a layer 0.003" thick, one tube will
cover
approximately 20 square inches.
RoHS Compliant:
Yes
Break-In Period:
Due to the unique carrier fluid used and the shapes and sizes
of the thermally conductive particles in Matrix, it will take a
minimum of 300 hours and multiple thermal cycles to achieve maximum
particle to particle thermal conduction and for the heatsink to CPU
interface to reach maximum conductivity. (This period will be longer in a
system without a fan on the heatsink.) On systems measuring actual
internal core temperatures via the CPU's internal diode, the measured
temperature will often drop significantly over this "break-in" period.
This break-in will occur during the normal use of the computer as long
as the computer is turned off from time to time and the interface is
allowed to cool to room temperature. Once the break-in is complete, the
computer can be left on if desired. |
